Modularity as a service
SPiN turns spacecraft into modular systems: MA61C, a plug-and-play intelligent data node, combined with model-based system engineering. Rapid, flexible, cost-effective designs — for manufacturers of every size.
01 What we offer
Model-based system engineering, a plug-and-play adapter, and the engineering behind it — delivered as a service, built around MA61C, the intelligent data node.
Satellite design services that lower prices and shorten lead times. The universal adapter opens a wider range of suppliers, and the service can carry avionics, software architecture, assembly, integration and testing.
Engineers integrate satellite components at a fraction of the time. MA61C handles the standards negotiation, so software integration is seamless and the path to launch is shorter.
Components integrate without user intervention. MA61C recognises new devices and configures itself — no standard to choose, no driver to write, no harness to re-pin.
The platform
Multipurpose Adapter Generic Interface Connector
An intelligent, plug-and-play command and data handling system that integrates subsystems with the onboard software. It adapts the interface and protocol of any supplier to one standard — automatically.
Interfaces
The numbers
Modularity is not a slogan. It changes the schedule, the bill of materials and the risk profile of a mission.
50 %
Lower design cost
modular architecture vs. bespoke
0130 %
Lower production cost
off-the-shelf subsystems
021 yr
Less integration time
model-based engineering
032015
Founded in Darmstadt
now headquartered in Frascati
04Figures as published by SPiN across the MA61C service: design costs −50%, production costs −30%, integration time reduced by a year.
02 In orbit
From a 1U demonstrator on SpaceX Transporter-5 to the main computer of a re-entry capsule.
All missions & projectsThe tool
A drag-and-drop system for programming satellites, simulating missions and testing hardware. Assemble logical blocks like Lego and the tool generates flight-ready C++ — no programming experience required.
Connected components · MA61C at the centre of the diagram
03 Backed by
SPiN has raised €1.74M to date, including a €1.63M seed round closed in January 2024.
The company story
Working with
04 Newsroom
01 SPiN exhibited all 4 lines of MA61C universal plug-and-play intelligent data nodes at the International Astronautical Congress (IAC) 2026 in Antalya, Türkiye, on October 5–9.During the…
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02 On August 17th and 18th, SPiN welcomed the TestNest team to its Luxembourg facilities for a collaborative technical session. During the visit, SPiN supported TestNest in conducting FlatSat…
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03 SPiN has successfully demonstrated its MA61C adapter in ESA's FLPP project, enabling seamless integration between legacy and next-generation components and introducing a new modular…
Read“The electrical interfaces of DSI’s standard products usually have to be customised from customer to customer — and the re-design effort is not negligible. A product like the MA61C adapter would allow direct re-use of DSI products in different scenarios with minor changes, optimising re-use costs.”
Elias Hashem
CEO, DSI GmbH
Field note
This is the case modularity makes in one paragraph: a component that fits everywhere does not have to be redesigned for each mission.
Frascati, Italy · HQ
